What to Expect

This role involves development of suppliers, processes, and packages for data center applications. The job involves communicating well with internal and external teams, traveling to suppliers in different regions, and supporting bring-up of design and process of a package.

What You’ll Do
Work with cross-functional teams and OSAT manufacturers on package development and lead resolutions to achieve mass production
Lead root cause analysis and permanent countermeasures with the manufacturer, cross functional team of Engineers, GSMs and QE with appropriate mitigation strategies
Work cross functionally with Design and Reliability Engineering team, to ensure package can meet the design requirements
Monitor the supplier’s yield very minutely and take appropriate actions to predict and resolve excursions
Audit, assess and oversee equipment performance & monitor implemented process controls at several suppliers
Assess Supplier’s PFMEA and manufacturing process controls and drive continuous improvement
Monitor Supplier Production Capacity (Operations management)
What You’ll Bring
Minimum 2-3 years of working experience with development, and high-volume manufacturing of large system in package (SiP) packages. Experience with overmold, large BGA packages is plus
In depth understanding of PCB materials, specifications, and reliability standards to improve supplier performance for incumbent and new PCB suppliers
Minimum 2 years of experience working with Surface-mount technology (SMT) and in-depth experience to resolve SMT process associated challenges
Experience driving OSATs as a customer. Clearly setting expectations on quality, schedule and ensuring timelines are met. Ensure quality spec alignment across 3 or 4 vendors
Deep knowledge of reliability failure modes, FMEA for process interactions especially for SMT components including power modules, inductors, and capacitors
Process knowledge/experience/depth/materials understanding of overmold, solder pastes, fluxes, reflow temps, laser and saw processes
Experience in executing DOEs, sample size definitions, understanding control plans/sampling frequency, data analysis using statistical models
Detailed understanding of JEDEC, AEC-Q, RoHS and IPC and other such standards/requirements
Has experience with NPI activities for high volume manufacturing
Understands applications of Cpk, GR&Rs and process qualification methodologies, basic understanding of signal and power integrity aspects of packaging

PALO ALTO, California

Full time