ASIC Design Engineer – Fabric/Interconnect – 200551837 -Santa Clara, California, United States

Apple

Imagine what you could do here. At Apple, phenomenal ideas have a way of becoming phenomenal products, services, and customer experiences very quickly.

Apple is owning the charge in dedication mobile computing with innovative SOC’s announced with each of its revolutionary new product offerings. At the core of all Apple mobile SOC’s, is an on-chip system interconnect bus that supplies the SOC agents with their requested load and store data from on chip and off chip memories. With every generation the max bandwidth, the lowest latency, the lowest area, and lowest power requirements are more exacting and require sophisticated planning in order to achieve on Apple’s schedules!

Be part of the team creating the architecture and design for the on-chip system interconnect bus for next generation Apple SOC’s!

As a member of the SoC Design team, you will be responsible for the following:

– Analyze architectural requirements of next generation of on-chip fabric and define scalable interconnect components
– Coding high-quality RTL, with embedded assertions and cover points.
– Writing detailed micro-architectural specifications.
– Work with multi-functional team to define and implement logic IP.
– Collaborating with multi-functional teams to explore solutions to improve performance while minimizing power and area.
– Working closely with design verification and formal verification teams to debug and verify functionality and performance.

 

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