Do you love taking on big challenges that require exceptionally creative solutions? Do you deeply understand how an incredible camera experience should work? As part of our Camera Technologies group, you’ll help design the innovative technology that allows each generation of Apple products to produce photos even more incredible than the last. You’ll design and develop groundbreaking ideas for everything involved in our camera systems, from sensor to lens. You’ll collaborate with teams across Apple to research, design, develop, test, and qualify camera hardware for Apple products. Together, we’ll craft a magical photography experience that redefines what millions of customers can expect from their cameras.

The Camera Hardware Engineering group is responsible for the design, development, and innovation of camera hardware for all related Apple products. Our target is to deliver extraordinary hardware to enable outstanding camera user experience. We are looking for an enthusiastic, passionate individual who can help us with tomorrow’s challenges!

• Determine component level requirements, and develop schematic designs for innovative camera modules components containing image sensors, microcontrollers, low-noise power supplies, AF/OIS drivers, and high-speed serial interfaces
• Analyze circuit parasitics and tolerances to ensure correct operation over the specified voltage and temperature ranges
• Supervise layout for PCB, Flex, and substrates
• Familiarity with challenges relating to power quality, high-speed signal integrity and control interface
• Author clear and comprehensive electrical documentation for design and manufacturing partners to complete design, test and validation
• Collaborate with X-functional teams to simulate, test, and validate performance of all designs
• Develop electronic prototypes for new camera features and product concepts
• Occasional travel may be required, but is not a critical component of this position

BS in Electrical or Computer EngineeringAnalog and digital circuit design including Schematics capture and supervising layout for substrate, rigid PCB or FlexKnowledge of signal and power integrity (High-speed design, PDN analysis)System integration knowledge for grounding, shielding, EMI, EMC and ESD