IC Package Process Engineer, Dojo – PALO ALTO, California

Tesla

What to Expect

In this highly visible role, you will be responsible for assembly process for advanced IC package including pathfinding, development and high volume manufacturing.

What You’ll Do
Work with cross-functional groups at Tesla and lead SoC packaging assembly process integration at Tesla 
Explore and drive industry on advance semiconductor packaging technology development for new leading-edge products 
Work with OSATs vendors to bring advanced packaging solutions from concept to high volume manufacturing
What You’ll Bring
Bachelor’s Degree in a relevant field, or equivalent experience
2+ year experience in semiconductor packaging technology, design and manufacturing process, or the equivalent in experience and evidence of exceptional ability
Expert knowledge in 2D/2.5D/3D packaging technology development and qualification 
Solid experience in advanced packaging assembly processes and failure analysis 
Excellent engineering problem solving skills with strong physics and fundamentals 
Excellent communication skills to work well with internal, cross functional teams and overseas suppliers 
Optical module integration experience is a strong plus

PALO ALTO, California

Full time

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