What to Expect

In this highly visible role, you will be responsible for mechanical simulation and materials characterization of advanced IC packaging. You will drive packaging design for manufacturing and reliability, and product level qualification.

What You’ll Do
Numerical mechanical simulation of advanced IC packages chip-to-packaging interaction and packaging-to-system interaction to provide design guidance for yield and reliability 
Perform first-principles analysis for component warpage, stress-strain for 2.5D/3D package materials, solder joint reliability, stacked via etc.
Model and simulate manufacturing and assembly process for conventional and advance packaging process, die to substrate joint process, underfill flow and curing process, package to board SMT process 
Conduct first-order packaging thermal and mold flow analysis to optimize structural design 
Packaging materials characterization to support new packaging architecture and materials selection using TMA, DMA, nanoindentation, lap shear, DSC, TGA etc and applying adequate material models to precisely describe physical behavior
What You’ll Bring
Master’s Degree or equivalent with 5+ year experience in IC packaging mechanical/material engineering or related fields
Strong hands-on experience of major FEM tools(e.g., ANSYS, ABAQUS, etc.) 
Deep understanding of packaging materials, mechanical characterization and qualification methodology 
Knowledgeable of advanced packaging technology, e.g fan-out, SoC&HBM integration HPC packaging, 3D IC structural concept 
Excellent engineering problem solving skills with strong physics and fundamentals 
Nice to have programming experience using Matlab, Python and fundamental machine learning capability

PALO ALTO, California

Full time